Inductively Coupled Plasma Etching (ICP RIE)
Reactive Ion Etching and deposition
Oxford Instrument, Plasma Pro NGP 80
Le attrezzature presenti all’interno della piattaforma prototipazione consentono lo sviluppo di micro e nano strutture attraverso l’utilizzo di tecniche litografiche avanzate che fanno uso di fasci ionici ed elettronici e che permettono l’attacco selettivo di superfici tramite plasmi reattivi. I laboratori sono attrezzati con camere bianche che consentono la fabbricazione di dispositivi e, più in generale, di dimostratori tecnologici con immediato interesse industriale.
Attrezzature disponibili in piattaforma:
Reactive Ion Etching and deposition
Oxford Instrument, Plasma Pro NGP 80
Molecular Film Deposition System
by Organic Spintronics
The apparatus works in UHV environment for ultra-clean deposition processes of molecular systems, having significant volatility at relatively low temperature (i.e., below the molecule decomposition point) by means of dedicated Knudsen cells. Applications are expected in the fields of active organic films and nanostructures, including OLED, OFET, nanoelectronics, nanosensing and energetics.
Multi Technique Electron Beam Lithography
Raith nanofabrication, eLINE Plus
eLINE Plus combines an Electron Beam Lithography system with an open platform for further optional nanofabrication processes and techniques in a single tool.
Dual Beam Focused Ion Beam
Versa™ 3D DualBeam™ (FIB/SEM)
The instrument is a Focused Ion Beam (FIB) combined with a Scanning Electron Microscopy (SEM). In a DualBeam, the electron and ion beams intersect at a 52° angle at a coincident point near the sample surface, allowing immediate, high resolution SEM imaging of the FIB-milled surface. Such systems combine the benefits of both the SEM and FIB and provide complementary imaging and beam chemistry capabilities.