Brochure BRIT

Piattaforma prototipazione

Le attrezzature presenti all’interno della piattaforma prototipazione consentono lo sviluppo di micro e nano strutture attraverso l’utilizzo di tecniche litografiche avanzate che fanno uso di fasci ionici ed elettronici e che permettono l’attacco selettivo di superfici tramite plasmi reattivi. I laboratori sono attrezzati con camere bianche che consentono la fabbricazione di dispositivi e, più in generale, di dimostratori tecnologici con immediato interesse industriale.

Attrezzature disponibili in piattaforma:

Inductively Coupled Plasma Etching (ICP RIE)

Inductively Coupled Plasma and Reactive Ion Etching (ICP RIE)
Oxford Instrument, Plasma Pro NGP 80

Reactive Ion Etching (RIE) is a simple operation, and an economical solution for general plasma etching. The substrate is placed on a graphite “coverplate” to avoid sputtering/re-deposition of electrode material and gas is injected into process chamber via “showerhead” gas inlet in the top electrode. Negative self-bias forms on lower electrode and a single RF plasma source determines both ion density and energy.

Molecular Film Deposition

Molecular Film Deposition System
by Organic Spintronics

The apparatus works in UHV environment for ultra-clean deposition processes of molecular systems, having significant volatility at relatively low temperature (i.e., below the molecule decomposition point) by means of dedicated Knudsen cells. Applications are expected in the fields of active organic films and nanostructures, including OLED, OFET, nanoelectronics, nanosensing and energetics.

 

Dual Beam Focused Ion Beam

Focused ion beam scanning electron microscopy (SEM/FIB)
Versa™ 3D LoVac DualBeam™

The instrument is a Focused Ion Beam (FIB) combined with a Scanning Electron Microscopy (SEM). In a DualBeam, the electron and ion beams intersect at a 52° angle at a coincident point near the sample surface, allowing immediate, high resolution SEM imaging of the FIB-milled surface. Such systems combine the benefits of both the SEM and FIB and provide complementary imaging and beam chemistry capabilities.

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